Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8816217 | Polyimides and fluoropolymer bonding layer with improved copper heat seal strength | Haibin Zheng, Gregory Douglas Clements, Blair Jones, Toshinori Mizuguchi | 2014-08-26 |