Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for encapsulating electronic components on a wafer

Method for encapsulating electronic components on a wafer

US Patent 8785297 · Granted Jul 22, 2014

Estimated economic value: $2,601,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Electronic device including interposer substrate carrying mica substrate with ba2023
Encapsulated flexible thin-film micro-batteries2022
Sensor device for geometrically testing parts2019
Methods for encapsulating flexible thin-film micro-batteries to protect against 2019
Method for forming a microbattery2016
Method of direct encapsulation of a thin-film lithium-ion type battery on the su2014
Method for manufacturing semiconductor chips from a semiconductor wafer2014
Method for thinning and dicing electronic circuit wafers2013
Method for thinning and dicing electronic circuit wafers2013
Method for manufacturing semiconductor chips from a semiconductor wafer2013
Surface-mounted silicon chip2012
Surface-mounted silicon chip2012