Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Electronic device including interposer substrate carrying mica substrate with battery layer environmentally sealed thereto

Electronic device including interposer substrate carrying mica substrate with battery layer environmentally sealed thereto

US Patent 11575172 · Granted Feb 7, 2023

Estimated economic value: $34,164,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Encapsulated flexible thin-film micro-batteries2022
Sensor device for geometrically testing parts2019
Methods for encapsulating flexible thin-film micro-batteries to protect against 2019
Method for forming a microbattery2016
Method for encapsulating electronic components on a wafer2014
Method for manufacturing semiconductor chips from a semiconductor wafer2014
Method for thinning and dicing electronic circuit wafers2013
Method for manufacturing semiconductor chips from a semiconductor wafer2013
Surface-mounted silicon chip2012
Method for encapsulating electronic components on a wafer2012