Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8785297 | Method for encapsulating electronic components on a wafer | Vincent Jarry, Laurent Barreau | 2014-07-22 |
| 8486763 | Method for thinning and dicing electronic circuit wafers | Vincent Jarry | 2013-07-16 |
| 8309403 | Method for encapsulating electronic components on a wafer | Vincent Jarry, Laurent Barreau | 2012-11-13 |