Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Pads with different width in a scribe line region and method for manufacturing these pads

Pads with different width in a scribe line region and method for manufacturing these pads

US Patent 8748295 · Granted Jun 10, 2014

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

IC structure with interdigitated conductive elements between metal guard structu2020
Interconnect structure having power rail structure and related method2019
Mechanically anchored C4 pad and method of forming same2019
Wafer rigidity with reinforcement structure2019
Wafer reinforcement to reduce wafer curvature2019
Interconnect structures for a security application2019
Silicon-on-insulator chip having multiple crystal orientations2019
Interconnect structure having power rail structure and related method2018
IC structure integrity sensor having interdigitated conductive elements2018
Wafer reinforcement to reduce wafer curvature2017
Interconnect structures with variable dopant levels2017
Wafer rigidity with reinforcement structure2017