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Home › Method for fabricating a through wire interconnect (TWI) on a semiconductor substrate having a bonded connection and an encapsulating polymer layer

Method for fabricating a through wire interconnect (TWI) on a semiconductor substrate having a bonded connection and an encapsulating polymer layer

US Patent 8741667 · Granted Jun 3, 2014

Estimated economic value: $10,068,000 ⓘ

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