Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Etchant-free methods of producing a gap between two layers, and devices produced thereby

Etchant-free methods of producing a gap between two layers, and devices produced thereby

US Patent 8704316 · Granted Apr 22, 2014

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

High electromechanical coupling strength hollow disk resonators2025
Electrical stiffness-based sensor2025
Quantum circuit with trench capacitor2024
Inference focus for offline training of SRAM inference engine in binary neural n2023
Inference focus for offline training of SRAM inference engine in binary neural n2023
Handler bonding and debonding for semiconductor dies2022
High speed handling of ultra-small chips by selective laser bonding and debondin2022
Wafer level integration including design/co-design, structure process, equipment2021
Permanent wafer handlers with through silicon vias for thermalization and qubit 2021
Handler bonding and debonding for semiconductor dies2021
Electronics miniaturization platform for medication verification and tracking2021
Heterogeneous miniaturization platform2021