Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Simplified copper-copper bonding

Simplified copper-copper bonding

US Patent 8647983 · Granted Feb 11, 2014

Estimated economic value: $5,411,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Protection device for an electrical circuit, electrical circuit equipped with su2023
Process for manufacturing assembly pads on a carrier for the self-assembly of an2022
Method of assembly by direct bonding between two elements, each element comprisi2022
Method for self-assembling microelectronic components2021
Treatment, before the bonding of a mixed Cu-oxide surface, by a plasma containin2021
Treatment, before the bonding of a mixed Cu-oxide surface, by a plasma containin2021
Direct metal bonding method2018
Plurality of substrates bonded by direct bonding of copper recesses2018
Method of planarizing recesses filled with copper2017
Method for modifying the crystalline structure of a copper element2017
Method for modifying the crystalline structure of a copper element2017
Method for modifying the crystalline structure of a copper element2017