Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › MEMS packaging with etching and thinning of lid wafer to form lids and expose device wafer bond pads

MEMS packaging with etching and thinning of lid wafer to form lids and expose device wafer bond pads

US Patent 8597985 · Granted Dec 3, 2013

Estimated economic value: $14,163,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Nonlinear on-chip optical devices using AlScN2024
Plasma-based method for delayering of circuits2023
Solid-state tuning behavior in acoustic resonators2022
Hybrid piezoelectric microresonator2022
Microfabricated ion trap chip with in situ radio-frequency sensing2021
Neural interface methods and apparatus to provide artificial sensory capabilitie2021
Microfabricated ion trap chip with an integrated microwave antenna2021
Focusing transformers/filters in isotropic/anisotropic piezoelectrics2021
Hybrid semiconductor-piezoacoustic radiofrequency device2020
Systems and methods for interferometric end point detection for a focused ion be2019
Ion trapping for quantum information processing2019
Lateral vias for connections to buried microconductors and methods thereof2019