Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8597985 | MEMS packaging with etching and thinning of lid wafer to form lids and expose device wafer bond pads | Rajen Chanchani, Christopher Nordquist, Roy H. Olsson, Randy J. Shul, Catalina Ahlers +2 more | 2013-12-03 |