Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and system for non-destructive determination of dielectric breakdown voltage in a semiconductor wafer

Method and system for non-destructive determination of dielectric breakdown voltage in a semiconductor wafer

US Patent 8501504 · Granted Aug 6, 2013

Estimated economic value: $2,454,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Systems and methods for monitoring and detecting symptoms of infectious conditio2022
Reliability aware thermal design2016
Capacitors positioned at the device level in an integrated circuit product and m2016
Capacitors positioned at the device level in an integrated circuit product and m2015
Copper interconnects with improved electromigration lifetime2014
Dielectric breakdown lifetime enhancement using alternating current (AC) capacit2011
Dielectric breakdown lifetime enhancement using alternating current (AC) capacit2011
Dielectric breakdown lifetime enhancement using alternating current (AC) capacit2011
Dielectric breakdown lifetime enhancement using alternating current (AC) capacit2011
Strike-off beam and spreader plow assembly for placer/spreader2010
Composite barrier layers with controlled copper interface surface roughness2010
Strike-off beam and spreader plow assembly for placer/spreader2008