Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Atomic layer deposition encapsulation for power amplifiers in RF circuits

Atomic layer deposition encapsulation for power amplifiers in RF circuits

US Patent 8492908 · Granted Jul 23, 2013

Estimated economic value: $5,261,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

RF devices with enhanced performance and methods of forming the same2025
RF devices with enhanced performance and methods of forming the same2024
Double-sided integrated circuit module having an exposed semiconductor die2024
RF devices with enhanced performance and methods of forming the same2022
Microelectronics package with vertically stacked dies2021
Wafer-level package with enhanced performance and manufacturing method thereof2021
Wafer-level package with enhanced performance2020
Microelectronics package with vertically stacked dies2020
Wafer-level package with enhanced performance2020
Wafer-level packaging for enhanced performance2020
Wafer-level package with enhanced performance2019
Wafer-level packaging for enhanced performance2019