Microelectronics package with vertically stacked dies

Assignee

• Qorvo Us

Inventors

• Julio C. Costa (114 patents)
• Robert Aigner (92 patents)
• Gernot Fattinger (30 patents)
• Dirk Robert Walter Leipold (169 patents)
• George Maxim (193 patents)
• Baker Scott (180 patents)
• Merrill Albert Hatcher, Jr. (23 patents)
• Jon Chadwick (14 patents)

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