Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Application of HIPIMS to through silicon via metallization in three-dimensional wafer packaging

Application of HIPIMS to through silicon via metallization in three-dimensional wafer packaging

US Patent 8475634 · Granted Jul 2, 2013

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Low voltage MEMS relay filled with alternative gas mixture to SF62023
Chamber for degassing substrates2023
RF capacitive coupled etch reactor2023
Vacuum plasma workpiece treatment apparatus2022
Reactive sputtering with HIPIMS2022
RF capacitive coupled dual frequency etch reactor2022
Arc suppression and pulsing in high power impulse magnetron sputtering (HIPIMS)2021
Arc suppression and pulsing in high power impulse magnetron sputtering (HIPIMS)2021
Vacuum treatment chamber and method of manufacturing a vacuum treated plate-shap2021
Reactive sputtering with HIPIMs2020
RF substrate bias with high power impulse magnetron sputtering (HIPIMS)2020
RF substrate bias with high power impulse magnetron sputtering (HIPIMS)2020