Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Thermal enhancement for multi-layer semiconductor stacks

Thermal enhancement for multi-layer semiconductor stacks

US Patent 8445918 · Granted May 21, 2013

Estimated economic value: $6,083,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

X-ray sensitive materials for data protection2024
Creating inductors, resistors, capacitors and other structures in printed circui2024
Secure hardware threat protection2023
Direct current blocking capacitors and method of attaching an IC package to a PC2023
Leakage characterization for electronic circuit temperature monitoring2023
Modular computing device with common AC power2022
Electrical connection management using a card2021
Chip interconnect devices2021
Secure crypto module including optical glass security layer2021
Secure crypto module including electrical shorting security layers2021
Secure hardware threat protection2021
X-ray sensitive device to detect an inspection2021