Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Coupling piezoelectric material generated stresses to devices formed in integrated circuits

Coupling piezoelectric material generated stresses to devices formed in integrated circuits

US Patent 8405279 · Granted Mar 26, 2013

Estimated economic value: $5,395,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Antenna package and method for manufacturing an antenna package2025
Antenna package structure2025
Voltage-swing method for carbon capture using porous carbons2025
Artificial intelligence based materials discovery building from documents and re2025
Carbon dioxide membrane filter with graphene crown pores2025
Multiple dipole line trap system2024
Compressible fluid separator pump2024
Area and power efficient implementation of resistive processing units using comp2024
Two-system gas stream separation2024
Rotational oscillation sensor with a multiple dipole line trap system2023
Area and power efficient implementation of resistive processing units using comp2023
Bonding element and method for manufacturing the same2023