Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Multi-tiered integrated circuit package

Multi-tiered integrated circuit package

US Patent 8354743 · Granted Jan 15, 2013

Estimated economic value: $23,966,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Automatic shaker screen cleaner2017
Integrated circuit package including wire bond and electrically conductive adhes2014
Systems and methods for three dimensional sensors2013
Integrated circuit package including a thermally and electrically conductive pac2013
Integrated circuit package including a thermally and electrically conductive pac2013
Dual-dual lockstep processor assemblies and modules2011
Packaged die heater2011
SOI on package hypersensitive sensor2011
Method and system for stacking integrated circuits2011
Method of manufacturing flexible semiconductor assemblies2010
Method and system for stacking integrated circuits2010
Integrated circuit package with top-side conduction cooling2009