Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and system for stacking integrated circuits

Method and system for stacking integrated circuits

US Patent 7700409 · Granted Apr 20, 2010

Estimated economic value: $8,407,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Power cycling power on reset circuit for fuse initialization circuitry2015
Systems and methods for three dimensional sensors2013
Integrated circuit package including a thermally and electrically conductive pac2013
Multi-tiered integrated circuit package2013
Packaged die heater2011
SOI on package hypersensitive sensor2011
Method and system for stacking integrated circuits2011
Integrated circuit package with top-side conduction cooling2009
Level shift circuit with power sequence control2009
Vertical die chip-on-board2006
Stacked ball grid array2003
Method to permit high temperature assembly processes for magnetically sensitive 2000