Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Array-molded package-on-package having redistribution lines

Array-molded package-on-package having redistribution lines

US Patent 8304285 · Granted Nov 6, 2012

Estimated economic value: $2,604,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device package and method of manufacturing the same2025
Antenna device2025
Semiconductor package structure and method of manufacturing the same2024
Semiconductor device package including a reinforcement structure on an electroni2022
Electrical device and method for manufacturing the same2021
Semiconductor package with lead frame and recessed solder terminals2019
Semiconductor package structure, package on package structure and packaging meth2019
Semiconductor package with lead frame and recessed solder terminals2018
Packaged semiconductor devices2018
Method and structure of packaging semiconductor devices2016
Circuit assembly2016
Semiconductor flip-chip system having oblong connectors and reduced trace pitche2015