Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Light-emitting diode package and wafer-level packaging process of light-emitting diode

Light-emitting diode package and wafer-level packaging process of light-emitting diode

US Patent 8278681 · Granted Oct 2, 2012

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Pixel package, method for forming the same, and display device using the same2025
Micro light-emitting diode and micro light-emitting device with rough surface an2025
Light-emitting diode packaging module2025
Light-emitting device and display screen including the same2025
Light-emitting diode packaging module having encapsulated array of LED chips2025
Structure and method for transferring a micro semiconductor element by applying 2024
Light-emitting diode packaging module2024
Micro light-emitting element and device and transfer method thereof2024
Micro light-emitting device and display2023
Micro light-emitting element and device, and use and production method thereof2023
Light-emitting assembly with raised adhesive layer2023
Micro light-emitting component, micro light-emitting component matrix, and metho2023