Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Wafer level package (WLP) device having bump assemblies including a barrier metal

Wafer level package (WLP) device having bump assemblies including a barrier metal

US Patent 8259464 · Granted Sep 4, 2012

Estimated economic value: $39,802,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Exposed die sensor package2020
Optical sensor packages employing cloaking layers2019
MEMS-based wafer level packaging for thermo-electric IR detectors2019
High-resolution electric field sensor in cover glass2019
Pad defined contact for wafer level package2019
Fully integrated gas concentration sensor2019
Ultraviolet sensor having filter2018
Wafer-level package device2018
Fully integrated gas concentration sensor2017
Enhanced board level reliability for wafer level packages2017
Wafer level device and method with cantilever pillar structure2017
Fan-out and heterogeneous packaging of electronic components2017