Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Chip package structure including heat dissipation device and an insulation sheet

Chip package structure including heat dissipation device and an insulation sheet

US Patent 8247891 · Granted Aug 21, 2012

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Firmware update application installing method and embedded device thereof2025
Electronic module2025
Lead guides having a recessed face2024
Electronic structure having a transformer2024
Stacked electronic module and method to make the same2023
Coaxial laser light source apparatus2023
Electronic module2023
Electronic module2023
Electronic module2023
Laser light source depolarizer and projection device having the same2023
Electronic structure having a transformer2023
Image capturing assembly, lens module and electronic device2022