Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Circuitized substrates utilizing smooth-sided conductive layers as part thereof

Circuitized substrates utilizing smooth-sided conductive layers as part thereof

US Patent 8242376 · Granted Aug 14, 2012

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method for controlling a display, computer program and mixed reality display dev2024
Method of making a circuitized substrate2017
Electrically conductive adhesive (ECA) for multilayer device interconnects2016
Electrically conductive adhesive (ECA) for multilayer device interconnects2016
Coreless layer buildup structure with LGA and joining layer2016
Conducting paste for device level interconnects2014
Substrate having internal capacitor and method of making same2013
Solder and electrically conductive adhesive based interconnection for CZT crysta2013
Electronic package with thermal interposer and method of making same2013
Coreless layer buildup structure2013
Coreless layer buildup structure with LGA2013
Method of making halogen-free circuitized substrate with reduced thermal expansi2013