Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Embedding thin film resistors in substrates in power delivery networks

Embedding thin film resistors in substrates in power delivery networks

US Patent 8228680 · Granted Jul 24, 2012

Estimated economic value: $18,521,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Electroadhesives system isolation in apparel2025
Warp knit component with weft inlays2025
Inhaler monitoring acoustic box2025
Co-planar interconnection mechanisms for circuit boards2025
Vertical embedded component in a printed circuit board blind hole2023
Methods to pattern TFC and incorporation in the ODI architecture and in any buil2023
Substrate integrated inductor with composite magnetic resin layer2022
Packaged die stacks with stacked capacitors and methods of assembling same2021
Compact semiconductor chip system and method2021
Over-molded IC package with in-mold capacitor2021
Magnetic small footprint inductor array module for on-package voltage regulator2020
Packaged die stacks with stacked capacitors and methods of assembling same2020