Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of manufacturing a multilayer interconnection structure in a semiconductor device

Method of manufacturing a multilayer interconnection structure in a semiconductor device

US Patent 8168532 · Granted May 1, 2012

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Wiring structure, method of manufacturing the same, and imaging device2025
Imaging device2025
Solid-state imaging device and electronic apparatus2025
Semiconductor device, manufacturing method, solid state image sensor, and electr2025
Backside illumination type solid-state imaging device, manufacturing method for 2025
Wiring board and semiconductor device each having non-photosensitive thermosetti2025
Solid-state imaging device and electronic device including coupling structures f2025
Solid-state imaging device and electronic apparatus2024
Solid-state imaging device and electronic apparatus2024
Three-dimensionally structured imaging device2024
Solid-state imaging device and electronic apparatus2024
Light detecting device with multiple substrates2024