Assignee
Inventors
- Mou-Shiung Lin (354 patents)
- Ming-Ta Lei (58 patents)
- Chuen-Jye Lin (16 patents)
{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Structure and manufacturing method of a chip scale package", "item": "https://www.patentleaderboard.com/patent/8158508"}]}
Skip to contentUS Patent 8158508 · Granted Apr 17, 2012