Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for plasma-enhanced physical vapor deposition of copper with RF source power applied to the target

Method for plasma-enhanced physical vapor deposition of copper with RF source power applied to the target

US Patent 8062484 · Granted Nov 22, 2011

Estimated economic value: $8,445,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Systems and methods for providing a trajectory planning engine for unmanned airc2025
Apparatus, systems, and method of providing an unmanned and manned air traffic m2025
Apparatus, systems, and methods for providing surveillance services for unmanned2024
Liquid electrolyte for lithium metal battery2024
Electrochemical cell design with lithium metal anode2023
Trip planning with energy constraint2023
Apparatus, system and method for managing airspace for unmanned aerial vehicles2023
Anode structure for a lithium metal battery2022
Shutter disk for physical vapor deposition chamber2021
Liquid electrolyte for a lithium metal battery2021
Corrosion resistant current collector for lithium metal anode2020
Apparatus, system and method for managing airspace for unmanned aerial vehicles2020