Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and system for centering wafer on chuck

Method and system for centering wafer on chuck

US Patent 8060330 · Granted Nov 15, 2011

Estimated economic value: $16,163,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Making transmission control protocol (TCP) sessions robust in a socket replicati2025
Large spot spectral sensing to control spatial setpoints2025
Computing device component monitoring system2025
Communication, authentication, and validation using LoRaWAN protocol2025
System and method for determining device status using LoRaWAN2025
Increasing robustness of connections by offloading keep alive protocol data unit2024
Mobile device transaction processing system and method using LoRaWAN communicati2024
Validation and registration for information handling systems2024
Edge ring arrangement with moveable edge rings2024
Validating transactions between entities using LoRaWAN protocol2024
Memory leak detection using real-time memory growth pattern analysis2024
Application identification and path selection at a wireless access point for loc2024