{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Electrical property altering, planar member with solder element in IC chip package", "item": "https://www.patentleaderboard.com/patent/8044512"}]}
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Home › Electrical property altering, planar member with solder element in IC chip package

Electrical property altering, planar member with solder element in IC chip package

US Patent 8044512 · Granted Oct 25, 2011

Estimated economic value: $17,275,000 ⓘ

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