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Home › Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool

Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool

US Patent 8010222 · Granted Aug 30, 2011

Estimated economic value: $17,103,000 ⓘ

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