{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Power electronic package having two substrates with multiple semiconductor chips and electronic components", "item": "https://www.patentleaderboard.com/patent/7999369"}]}
Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Power electronic package having two substrates with multiple semiconductor chips and electronic components

Power electronic package having two substrates with multiple semiconductor chips and electronic components

US Patent 7999369 · Granted Aug 16, 2011

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor switch comprising a short-circuit detection circuit2025
Power device with current sense2025
III-nitride power semiconductor based heterojunction diode2025
Sequential pedestrian trajectory prediction using step attention for collision a2025
Insulated gate bipolar transistor including trench Schottky electrode2025
Stand-by circuit2025
Power semiconductor device with an auxiliary gate structure2025
Heterojunction based half bridge2025
Mixed material power devices and driver circuits2025
III-V semiconductor device with integrated power transistor and start-up circuit2025
Thermal fluid sensor2024
System for predicting aggressive driving2024