CB

Cyril Buttay

TS The University Of Sheffield: 2 patents #17 of 262Top 7%
DE Denso: 2 patents #4,986 of 11,792Top 45%
UC University Of Cambridge: 2 patents #3 of 10Top 30%
CN CNRS: 1 patents #3,857 of 11,908Top 35%
U1 Universite Claude Bernad Lyon 1: 1 patents #222 of 791Top 30%
SI Supergrid Institute: 1 patents #21 of 44Top 50%
EL Ecole Centrale De Lyon: 1 patents #33 of 126Top 30%
IL Institut National Des Sciences Appliquées De Lyon: 1 patents #79 of 359Top 25%
Overall (All Time): #1,435,719 of 4,157,543Top 35%
3
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
11049795 Electronic power module comprising a dielectric support 2021-06-29
8432030 Power electronic package having two substrates with multiple semiconductor chips and electronic components Rajesh Kumar Malhan, C Mark Johnson, Jeremy Rashid, Florin Udrea 2013-04-30
7999369 Power electronic package having two substrates with multiple semiconductor chips and electronic components Rajesh Kumar Malhan, C. Mark Johnson, Jeremy Rashid, Florin Udrea 2011-08-16