Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11956914 | Sealed interface power module housing | Christina DiMarino, Mark Cairnie, Dushan Boroyevich, Rolando Burgos | 2024-04-09 |
| 7999369 | Power electronic package having two substrates with multiple semiconductor chips and electronic components | Rajesh Kumar Malhan, Cyril Buttay, Jeremy Rashid, Florin Udrea | 2011-08-16 |
| 7557434 | Power electronic package having two substrates with multiple electronic components | Rajesh Kumar Malhan, Jeremy Rashid | 2009-07-07 |