Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods for forming an RF device with trench under bond pad feature

Methods for forming an RF device with trench under bond pad feature

US Patent 7998852 · Granted Aug 16, 2011

Estimated economic value: $3,558,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Hybrid device assemblies and method of fabrication2024
Power amplifier modules including topside cooling interfaces and methods for the2024
Amplifier modules and systems with ground terminals adjacent to power amplifier 2023
Hybrid device assemblies and method of fabrication2023
Ocean current and tidal power electric generator2023
Broadband power transistor devices and amplifiers with output T-match and harmon2023
Integrated multiple-path power amplifier2022
Power amplifiers and unmatched power amplifier devices with low baseband impedan2022
RF amplifiers with input-side fractional harmonic resonator circuits2022
Transistor with shield system including multilayer shield structure arrangement2022
Ocean current and tidal power electric generator2022
RF power transistor circuit2022