Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › High throughput across-wafer-variation mapping

High throughput across-wafer-variation mapping

US Patent 7990546 · Granted Aug 2, 2011

Estimated economic value: $5,317,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Reconstruction of a distorted image of an array of structural elements of a spec2025
Method and apparatus for transmitting and receiving control information in wirel2025
Method and apparatus for system information acquisition in wireless communicatio2025
Identification of an array in a semiconductor specimen2025
Method and apparatus for transmitting and receiving reference signal in wireless2025
Method of deep learning-based examination of a semiconductor specimen and system2024
Foldable laundry basket2024
EZE-pack laundry hamper2024
Reconstruction of a distorted image of an array of structural elements of a spec2023
Method and apparatus for transmitting and receiving reference signal in wireless2023
Contraction of an annuloplasty structure2023
Method and apparatus for system information acquisition in wireless communicatio2023