Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integrated conformal shielding method and process using redistributed chip packaging

Integrated conformal shielding method and process using redistributed chip packaging

US Patent 7981730 · Granted Jul 19, 2011

Estimated economic value: $3,535,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device with attached battery and method therefor2025
Semiconductor device package having thermal dissipation feature and method there2025
Semiconductor device with enclosed cavity and method therefor2025
Compact connectors with integrated wireless communication elements2025
Semiconductor device with open cavity and method therefor2025
Semiconductor device with open cavity and method therefor2025
Waveguide launcher in package based on high dielectric constant carrier2024
Semiconductor device packaging warpage control2024
Patterned and planarized under-bump metallization2024
Semiconductor device with self-aligned waveguide and method therefor2024
Semiconductor device assembly and method therefor2024
Semiconductor device with connector in package and method therefor2024