Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Direct contact to area efficient body tie process flow

Direct contact to area efficient body tie process flow

US Patent 7964897 · Granted Jun 21, 2011

Estimated economic value: $8,782,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Memory array with reduced leakage current2023
Integrated circuit stack including a patterned array of electrically conductive 2018
Memory cell with redundant carbon nanotube2017
Stabilization gas environments in a proton-exchanged lithium niobate optical chi2017
Compact self-aligned implantation transistor edge resistor for SRAM SEU mitigati2017
ph sensor with bonding agent disposed in a pattern2017
pH sensor with substrate or bonding layer configured to maintain piezoresistance2017
Integrated radiation sensitive circuit2017
Integrated circuit stack including a patterned array of electrically conductive 2017
Converter for analog inputs2016
Carbon nanotube memory cell with enhanced current control2015
CMOS logic circuit using passive internal body tie bias2015