Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Leadframe, semiconductor package and support lead for bonding with groundwires

Leadframe, semiconductor package and support lead for bonding with groundwires

US Patent 7875968 · Granted Jan 25, 2011

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor package2025
Power module with metal substrate2024
Pre-molded lead frames for semiconductor packages2023
Soldering a conductor to an aluminum metallization2022
Power module with metal substrate2022
Soldering a conductor to an aluminum metallization2021
Soldering a conductor to an aluminum metallization2021
Soldering a conductor to an aluminum metallization2020
Connection member with bulk body and electrically and thermally conductive coati2019
Electronic component employing a layered frame2014
Electronic component with layered frame2012
Non-leaded semiconductor package and a method to assemble the same2010