Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods of forming back side layers for thinned wafers

Methods of forming back side layers for thinned wafers

US Patent 7871899 · Granted Jan 18, 2011

Estimated economic value: $4,370,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device using EMC wafer support system and fabricating method there2025
Semiconductor device and manufacturing method thereof2025
Electronic device with top side pin array and manufacturing method thereof2025
Method and system for packing optimization of semiconductor devices2024
Semiconductor device and manufacturing method thereof2024
Displays with embedded light emitters2023
Displays with unpatterned layers of light-absorbing material2023
Surface-mountable pixel packages and pixel engines2023
Surface-mountable pixel packages and pixel engines2023
Displays with embedded light emitters2022
Method and system for packing optimization of semiconductor devices2022
Semiconductor device using EMC wafer support system and fabricating method there2021