Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Package and package assembly of power device

Package and package assembly of power device

US Patent 7847395 · Granted Dec 7, 2010

Estimated economic value: $4,055,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Display panel driving device and display panel driving method2025
Plasma etching apparatus and method for operating the same2024
Complex semiconductor packages and methods of fabricating the same2014
Power module having stacked flip-chip and method of fabricating the power module2014
Heat sink package2013
Power device packages having thermal electric modules using peltier effect and m2013
High power semiconductor package2013
Power device package and semiconductor package mold for fabricating the same2012
Power system module and method of fabricating the same2011
Power module for low thermal resistance and method of fabricating the same2011
Power device packages and methods of fabricating the same2011
Leadless package2010