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Home › Thermoplastic resin composition for semiconductor, adhesion film, lead frame, and semiconductor device using the same, and method of producing semiconductor device

Thermoplastic resin composition for semiconductor, adhesion film, lead frame, and semiconductor device using the same, and method of producing semiconductor device

US Patent 7843045 · Granted Nov 30, 2010

Estimated economic value: $134,000 ⓘ

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