Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Material for forming adhesion reinforcing layer, adhesion reinforcing layer, semiconductor device, and manufacturing method thereof

Material for forming adhesion reinforcing layer, adhesion reinforcing layer, semiconductor device, and manufacturing method thereof

US Patent 7830013 · Granted Nov 9, 2010

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

High-frequency circuit board and antenna module2025
Semiconductor apparatus and electronic apparatus2024
Package with built-in electronic components and electronic device2024
Externally-driven joint structure2023
Multicopter system and method for transferring goods2023
Actuator device, humanoid robot and power assist device2023
High-pressure tank2023
Filling member between a heat sink and substrate2022
Externally-driven joint structure2022
Actuator device, humanoid robot and power assist device2022
Microwave irradiation device, exhaust purification apparatus, automobile and man2020
Fine particle detector and exhaust gas purification apparatus2020