Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Flip-chip assembly with improved interconnect

Flip-chip assembly with improved interconnect

US Patent 7732253 · Granted Jun 8, 2010

Estimated economic value: $12,577,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Integrated circuit assembly with hybrid bonding2025
Hybrid reconstituted substrate for electronic packaging2024
Trench capacitor assembly for high capacitance density2024
Substrate comprising an inductor and a capacitor located in an encapsulation lay2023
Integrated module with electromagnetic shielding2023
Package with a substrate comprising protruding pad interconnects2023
Sub-module L-shaped millimeter wave antenna-in-package2023
Package comprising stacked filters with a shared substrate cap2023
Integrated circuit assembly with hybrid bonding2023
Trench capacitor assembly for high capacitance density2023
Stacked decoupling capacitors with integration in a substrate2022
Voltage regulation integrated circuit (IC) with circuit components in an integra2022