Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Noble metal layer formation for copper film deposition

Noble metal layer formation for copper film deposition

US Patent 7658970 · Granted Feb 9, 2010

Assignee

No assignee recorded.

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Image capturing apparatus, storage space adjusting method thereof and non-transi2020
Robot swing structure2019
Circuit board and manufacturing method thereof2017
Gas delivery apparatus and method for atomic layer deposition2014
Enhanced copper growth with ultrathin barrier layer for high performance interco2012
Enhanced copper growth with ultrathin barrier layer for high performance interco2012
Apparatus and method for hybrid chemical processing2011
Method and apparatus for generating a precursor for a semiconductor processing s2011
Method of adjusting write strategy of recordable disc2011
Method of adjusting write strategy of recordable disc2011
Cyclical deposition of refractory metal silicon nitride2011
Sequential deposition of tantalum nitride using a tantalum-containing precursor 2011