Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods for chemical mechanical planarization and for detecting endpoint of a CMP operation

Methods for chemical mechanical planarization and for detecting endpoint of a CMP operation

US Patent 7622052 · Granted Nov 24, 2009

Estimated economic value: $3,335,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Magnesium ion selective membranes2024
Lithographic apparatus, reflective member and a method of irradiating the unders2015
Steam generator arrangement2011
Method and apparatus for controlled slurry distribution2011
Method and apparatus for controlling slurry distribution2008
Methods for monitoring a chemical mechanical planarization process of a metal la2007
Methods for monitoring a chemical mechanical planarization process of a metal la2007
Methods for monitoring a chemical mechanical planarization process of a metal la2007
Methods for controlling the pressures of adjustable pressure zones of a work pie2006
Methods for controlling the pressures of adjustable pressure zones of a work pie2006
Injection of overfire air through the upper furnace arch for penetration and mix2006
Multiprobe detection system for chemical-mechanical planarization tool2005