Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for mounting a flip chip on a substrate

Method for mounting a flip chip on a substrate

US Patent 7597234 · Granted Oct 6, 2009

Assignee

No assignee recorded.

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Apparatus for mounting semiconductor chips2017
Device for dispensing adhesive on a substrate2016
Apparatus for mounting a flip chip on a substrate2012
Apparatus for mounting a flip chip on a substrate2012
Apparatus for mounting a flip chip on a substrate2012
Method for picking up semiconductor chips from a wafer table and method for moun2012
Apparatus and method for mounting or wiring semiconductor chips2007
Apparatus for placing a semiconductor chip as a flipchip on a substrate2006
Die bonder and/or wire bonder with a device for holding down a substrate2003