Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Apparatus for placing a semiconductor chip as a flipchip on a substrate

Apparatus for placing a semiconductor chip as a flipchip on a substrate

US Patent 7020954 · Granted Apr 4, 2006

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method for producing a sealing base in the ground2022
Apparatus for mounting semiconductor chips2017
Device for dispensing adhesive on a substrate2016
Method and apparatus for mounting semiconductor chips2015
Apparatus for mounting a flip chip on a substrate2012
Method for mounting a flip chip on a substrate2009
Apparatus for mounting semiconductor chips2007
Die bonder and/or wire bonder with a device for holding down a substrate2003