Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Chip package with a ring having a buffer groove that surrounds the active region of a chip

Chip package with a ring having a buffer groove that surrounds the active region of a chip

US Patent 7547962 · Granted Jun 16, 2009

Estimated economic value: $811,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Package structure and manufacturing method thereof2011
Method of making a semiconductor package and method of making a semiconductor de2010
Stackable semiconductor package2009
Stackable semiconductor package2009
Stackable semiconductor package2009
Stackable semiconductor package2009
Manufacturing method of a package structure2008
Electronic package structure and the packaging process thereof2008
Chip package and package process thereof2008
Chip package and package process thereof2008
Stackable semiconductor package2008
Stackable semiconductor package2008