Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Simultaneous selective polymer deposition and etch pitch doubling for sub 50nm line/space patterning

Simultaneous selective polymer deposition and etch pitch doubling for sub 50nm line/space patterning

US Patent 7531102 · Granted May 12, 2009

Estimated economic value: $14,965,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method for fabricating a strained structure and structure formed2025
Arrays of integrated analytical devices and methods for production2025
Material with enhanced sliding friction2024
Method for fabricating a strained structure and structure formed2023
Method for fabricating a strained structure and structure formed2022
Techniques providing metal gate devices with multiple barrier layers2021
Method for fabricating a strained structure and structure formed2021
Fin-like field effect transistor (FinFET) device and method of manufacturing sam2020
Arrays of integrated analytical devices and methods for production2020
Integrated circuit transistor structure with high germanium concentration SiGe s2020
Techniques providing metal gate devices with multiple barrier layers2019
Method for fabricating a strained structure and structure formed2019