Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Chip and package structure

Chip and package structure

US Patent 7518211 · Granted Apr 14, 2009

Estimated economic value: $1,666,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Die seal ring2013
Crack stopping structure and method for fabricating the same2011
Metal structure2010
Semiconductor wafer2010
Method for forming a metal structure2008
Fabrication of semiconductor integrated circuit chips2007
On-chip test circuit for assessing chip integrity2007
Semiconductor structure and fabricating method thereof2007
Flip chip package with reduced thermal stress2007
Parasitic capacitance-preventing dummy solder bump structure and method of makin2006
Structure of solder bumps with improved coplanarity and method of forming solder2002
Method of forming solder areas over a lead frame2002